Synthetic Diamond Set to Transform Thermal Management and Future RF Chips

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With AI accelerators, RF amplifiers and power electronics pushing thermal limits, synthetic diamond is emerging as a critical material. The new wafer-scale breakthrough enables scalable, low-defect substrates that can dramatically improve heat spreading, reduce data-center cooling costs, and eventually serve as an ultra-wide-bandgap semiconductor. Industry leaders say this progress lays the groundwork for next-gen high-frequency and high-voltage devices — and a potential strategic edge in global semiconductor competition.

[Nahid Hossen]

Synthetic diamond could redefine heat management for next-gen RF chips.